Bedrock RAI300

SolidRun Bedrock RAI300

Fanless Industrial Edge AI PC (AMD Ryzen™ AI 9 HX 370)

Bedrock RAI300 is a next-generation industrial fanless Edge AI computer, designed for AI/ML, machine vision, and advanced analytics close to the data source. It is powered by the AMD Ryzen™ AI 9 HX 370 with 12 Zen 5 cores / 24 threads (up to 5.1 GHz), an RDNA 3.5 iGPU, and an XDNA2 NPU delivering up to 50 AI TOPS. With AMD ROCm™ 7.x, you get a modern open software ecosystem that makes it easier to move AI from cloud development to edge deployment, with strong support for both Linux and Windows.

RAI300 is built for demanding environments with an advanced fanless thermal design and a rugged, ventless aluminum chassis. Its modular hardware enables you to choose the I/O profile that best fits the application—either a display-focused configuration for HMI/visualization or a network-focused setup for edge gateways and AI nodes. With support for high memory capacity and fast NVMe storage, larger models and data-intensive pipelines can be executed locally at the edge.

Key Features

• -40°C to 85°C, fanless/ventless, IP40.
• Up to 128 GB DDR5 (ECC support), unified memory for larger workloads
• 3x NVMe Gen4 2280 or up to 3x Hailo AI accelerators
• Variants: 4 displays + 2 GbE or 4 GbE + 2 displays
• USB4 40 Gbps, 4x USB 3.2 ports, console port
• 12–60V DC via terminal block (screw-lock), optional PLP NVMe
• TPM, WDT, redundant SPI flash
• 10-year guaranteed availability

Best for

• Edge AI & LLM workloads (running larger models locally)
• Machine vision and AI pipelines where RAM and GPU/NPU performance are critical
• Projects that require the latest AMD AI platform with an open software stack

Datasheet:

Bedrock RAI300

Technical documentation

• Bedrock RAI300