SolidRun launches Bedrock RAI300, a new fanless Edge AI PC featuring the AMD Ryzen™ AI 9 HX 370 (Zen 5) and ROCm™ 7.

SolidRun has launched Bedrock RAI300, a new industrial fanless Edge AI computer based on the AMD Ryzen™ AI 9 HX 370 (Zen 5) with support for the AMD ROCm™ 7 software stack. The combination of Zen 5 CPU cores, Radeon iGPU, XDNA2 NPU, and up to 128 GB DDR5 makes the RAI300 particularly well suited for local AI processing, where data is analyzed close to the source without reliance on the cloud. This makes the platform ideal for manufacturing, automation, machine vision, and other environments requiring high performance and stable 24/7 operation.

Outstanding AI performance in a compact industrial form factor

Bedrock RAI300 brings together advanced AI hardware in a compact and robust x86 design:

• 12 cores / 24 threads (Zen 5) up to 5.1 GHz
• Radeon 890M iGPU with 16 graphics cores
• Integrated NPU with 50 AI TOPS
• Up to 128 GB DDR5, enabling larger AI and LLM models to run locally

The close integration of CPU, GPU, NPU, and memory, together with ROCm™ 7, makes the RAI300 an exceptionally strong platform for Edge AI workloads, where performance and software flexibility are essential.

Designed for industrial environments: -40°C to 85°C

The RAI300 is built for demanding conditions with an advanced fanless thermal design that enables operation across the full industrial temperature range from -40°C to 85°C. The enclosure is made from rugged milled aluminum and is offered in two variants:

• 1.6-liter variant with support for up to 60W
• 0.6-liter “Tile” variant for conduction cooling (cold plate mounting)

The thermal design dissipates more than three times the heat of typical fanless systems, leveraging liquid metal TIM, 360° heat pipes, and a chimney-effect heat exchanger.

Modular platform with flexible I/O

Bedrock RAI300 fits seamlessly into SolidRun’s Bedrock ecosystem and can be configured using the same modular architecture:

• NIO boards (Networking & I/O)
• SX boards (Storage & Extensions)
• PM modules (Power)

The system can be tailored for either display-heavy configurations or network-focused edge setups, including:

• Up to 4 displays (HDMI 2.1 + 3x DP 2.1)
• Up to 4x 2.5GbE
• USB4 Type-C, 4x USB 3.2 and console port
• LTE-modem
• 3x NVMe Gen4 2280 (incl. enterprise NVMe med PLP)

All I/O is located on one side for easy integration into cabinets, racks, and edge installations.

Ready for Linux, Windows, server environments, and IoT

Bedrock RAI300 supports most Linux distributions, Windows Desktop, Windows Server, and Windows IoT, and can be delivered as a barebone system, providing flexibility in the choice of RAM and storage.

Bedrock RAI300 – key takeaways

• New AMD Edge AI-platform

The RAI300 is built on AMD’s latest AI technology, enabling data to be analyzed directly on site—such as images, video, or sensor data, quickly and efficiently without the need to send data to the cloud.

• Modern and open AI software (ROCm™ 7)

The open software platform makes it easier to develop, customize, and update AI solutions over time. This provides greater freedom and future-proofing compared to closed systems.

• Built for harsh environments

The RAI300 is fanless and built in a rugged enclosure, enabling stable operation in both cold and hot environments, from sub-zero temperatures to high heat, without the need for ongoing maintenance.

• Ready for large data volumes

With support for extensive memory and high-speed storage, the RAI300 can handle large data volumes and more advanced analytics directly on site.

• Flexible and easily adapted to the use case

The platform is modular, meaning it can be configured with the connections and features that best fit the application, whether the focus is on displays, networking, or data acquisition.

Availability and Ordering Information

Bedrock RAI300 can be ordered through Nord Technology as an official SolidRun partner.

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