Taicenn has published its latest product catalog for 2023, which introduces Taicenn’s industrial solutions for robust environments

Taicenn delivers industrial box PCs, industrial touch panel PCs and industrial screen products, which are specially designed for systems and applications that require excellent performance, reliability and stability at a high level and a longer delivery period.

Taicenn Industrial Box PC: Compact and Powerful

Taicenn Industrial Box PC is created to meet the needs of the most demanding industrial environments. The compact and robust construction makes it ideal for applications where space is tight but performance requirements are high. With expertise in Industrial Embedded hardware as well as Linux and Open Source software, we can adapt this solution precisely to your needs and ensure that your company chooses the optimal hardware solution for your projects.

Taicenn Industrial Panel PC: Flexibility and Scalability

Taicenn Industrial Panel PC is designed with a focus on flexibility and scalability. It is perfect for use in digital signage, industrial systems and IoT management. With our apprehensive technical knowledge within Panel PC solutions for industrial use, we can offer tailor-made solutions that meet your unique requirements.

Taicenn Industrial Monitor: Clear and robust screen

Taicenn’s industrial monitors are easy to integrate into various industrial systems, such as factories, by building into products, etc. They deliver a sharp and precise screen experience that is essential for many applications. They come both as touch monitors, for installation, free-hanging and with different degrees of IP security. Also available in many different sizes.

Contact us today to learn more about how our Taicenn Industrial solutions can make a difference to your business.

Telephone: +45 70 27 04 15

Email: email@nordtechnology.dk

Pressemeddelelse fra SolidRun – SolidRun launches new Bedrock R7000 – a fanlesss Edge-AI IPC with AMD RyzenTM 7840HS-processor og 3 Hailo-8TM AI-accelerators / High performance in a tiny, rugged housing

For robust environment

SolidRun has announced the world’s first rugged system design that combines 8-core AMD RyzenTM 7040 series processors with multiple Hailo-8TM AI accelerators to create its Bedrock R7000 Edge AI for artificial intelligence (AI) applications. This new member in SolidRun’s Bedrock family of fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.

Remarkable fanless cooling

The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4nm APU with 8C/16T Zen4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen4 lanes and up to three Hailo-8TM AI accelerators can be fully utilized together with NVME Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40ºC to 85ºC

Demand for such high-performance Edge AI box-PCs is growing in all segments of the embedded market, including Industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defense, and utility.

Highly efficient scalable performance

“Efficiency and scalability are key factors in advanced edge AI,” said Irad Stavi, IPC Product Line Manager at SolidRun. “Bedrock R7000 stands out as the first fanless IPC based on the ultra-efficient AMD Ryzen 7040 processor and the innovative modular design which enables out-of-the-box integration of 3 Hailo-8TM AI accelerators, each with 26 Tera Operations per Second (TOPS), or even more with a simple customization.”

“An important feature of Hailo-8TM AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules,” said Dima Caplan, Product Manager at Hailo. “SolidRun’s new Edge AI platform exhibits ample system resources which enable high AI performance at perfect scaling.”

Bedrock R7000 features

The Bedrock R7000 is equipped with an AMD RyzenTM 7 7840HS / 7840U processor, featuring 8 cores and 16 threads running at up to 5.1 GHz based on the AMD Zen4 4nm microarchitecture that also integrates the AMD Radeon™ 780M GPU with up to 12 CUs @ 2700 MHz. CPU power can be precisely adjusted in BIOS in an extremely wide range between 8W – 54W.

For Edge AI workloads, up to 3 Hailo-8TM AI accelerators can be installed with combined inferencing performance of up to 78 TOPS.

RAM and storage are modular with 2x SODIMMs supporting 64 GB DDR5 ECC/non-ECC, and 3 NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.

I/O includes 4 displays comprising HDMI 2.1 + 3x DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, 4 USB 3.2 ports and a console port. All I/O is conveniently organized on a single face to simplify integration.

Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.

Power, mechanical and thermal design

Bedrock R7000 electronic design is modular, SoM based. Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12V to 60V

The enclosure is made of heavy-duty machined aluminum with an anodized finish. It is offered in 3 variants – 1.0 liter enclosure for dissipating up to 30W by convection, 1.6 liter for 60W and an 0.6 liter “Tile” variant for conduction cooling. The enclosure is ideal for DIN-Rail mounting with a specially designed zero-force locking bracket.

Bedrock R7000 fanless design can handle up to 60W, which is over 3 times the cooling capacity of typical fanless PCs of similar size. Cooling innovations include liquid metal TIM, 360º stacked heat pipes, dual-layer chimney effect heat exchanger and thermal coupling of all internal devices.

The system operates reliably at a temperature range of -40ºC to 85ºC.

Specifications

CPU: AMD Ryzen™ 7840HS/U with Radeon 780M GPU
RAM: Dual channel DDR5 up to 64 GB ECC / non-ECC
Display: 1x HDMI 2.1 + 3x Display Port 2.1
Storage: Up to 3x NVMe PCIe Gen4 x 4
AI Acceleration: Up to 3x Hailo-8 M.2 AI Acceleration Module
LAN: 2x 2.5 GbE (Intel I226)
WLAN: WiFi 6E (Intel AX210)
Modem: 4G / 5G (Quectel)
USB: 1x USB 3.2 10 Gb/s + 3x USB 3.2 5 Gb/s
Console: Serial over USB
BIOS: AMI Aptio V
Operating systems: Windows 10/11/IoT, Linux
Power: DC 12V-60V
Temperature range: Up to -40ºC to 85ºC
Enclosure: All aluminum enclosure, fanless cooling
Dimensions: 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter, 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter, Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting: DIN-rail, wall, table top

Read about SolidRun

Nord Technology has recently made a distributor agreement with SolidRun. SolidRun is known for its innovative and ground-breaking products.

You can pre-order SolidRun products

If you are interested in a SolidRun product, send us an email and we will make sure that you receive ongoing information about product development and delivery times. It is also possible to pre-order.

SolidRun is a leading developer and manufacturer of embedded systems and network solutions for industrial use. They focus on delivering energy-efficient, powerful and innovative products for e.g. IoT and Edge AI. We are very happy to announce that Nord Technology has entered into a distribution agreement with SolidRun in the North.

Nord Technology – a technically strong partner

Partnerskabet er kommet i stand gennem en løbende dialog og møde med hele SolidRun teamet på Embedded World konferencen. SolidRun wanted a partner who is technically strong and can provide a complete service to customers. From the initial project clarification and selection of technology and hardware, to software setup and technical support.

At Nord Technology, it is our know-how and advice that we put into play when we deliver hardware and solutions to the industrial market and to projects where hardware of particularly good quality is a necessity. We have in-depth knowledge of the use of industrial PC units in a wide variety of contexts as well as a steadily growing production department in Ballerup, Copenhagen.

SolidRun produces innovative products for IoT and industry

We look forward to expanding our distribution business with the sale of SolidRun’s products in the North and will in the near future announce more ground-breaking products from them in the Industrial PC and IoT area in particular. Products that can already be pre-ordered, specially configured as needed and with a short delivery time.

Read about SolidRun

SolidRun is known for its innovative and ground-breaking products. Here you can learn more SolidRun and their products

You can pre-order SolidRun products

If you are interested in a SolidRun product, send us an email and we will make sure that you receive ongoing information about product development and delivery times. It is also possible to pre-order.

Contact us and book a meeting:

If any questions arise, give us a call. We are always open for a chat.

Send an Email

Or contact us by phone at +45 7027 0415

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– Press release from CompuLab –

Compulab launches Tensor-I22, a configurable 11th Gen. CoreTM fanless industrial computer

October 18, 2022, Yoqneam, Israel – Compulab launches Tensor-I22, the second generation in its innovative industrial computer line, Tensor.

Tensor-I22 is based on Intel’s Tiger Lake UP3 platform and is offered with Core i7, Core i5, and Celeron processors.

Full utilization of a great platform

Intel’s Tiger Lake UP3 platform combines a high-performance CPU with a leap forward in GPU performance over previous platforms. With Inherent deep learning and AI acceleration capabilities and high-speed PCIe Gen. 4 it enables the Tensor-I22 to be a very capable computer for the contemporary needs of cutting-edge industries.

Tensor-I22 fully utilizes the capability of the platform with a wide set of peripherals that include a comprehensive back interfaces module and customizable additional interfaces.

Ready for AI

Tensor-I22 is offered with an optional pre-installed Hailo-8 AI acceleration module with enhanced heat dissipation.

This option allows the Tensor-I22 to become a strong AI edge computer, using a very efficient neural network processor for demanding computer vision missions.

Remarkable features

Tensor-I22 main features:

• Intel 11th Core processor (Tiger Lake UP3) Core i7, Core i5 or Celeron, 15W / 28W TDP
• Fanless design with modular housing (min. 20×20 cm)
• Operating temperature range up to -40°C to 70°C
• 12V – 56V input voltage
• Optional multiple industrial ports: RS-232, RS-485, CAN bus, GPIOs
• Secure boot and TPM 2.0
• 5 year warranty and 15 years of availability

Specifications

Processor: Intel Core i7-1185G7E / Core i5-1145G7E / Celeron 6305E

Memory: Up to 64GB DDR4 in 2x SO-DIMM up to 3200MT/s

Storage: Up to 3 devices: M.2 NVMe, M.2 SATA, optional 2.5” disk

Display: 4 independent displays, 2x HDMI 1.4b + 2x mini Display Port 1.2

Ethernet: Up to 4 Gigabit Ethernet ports, two of them with possibility of PoE PSE or SFP+

Wireless connectivity: Wi-Fi 6E + Bluetooth 5.2, LTE / 5G modem

USB: 2 USB 3.1 + 2 USB 2.0 as standard, with up to 8 more ports available

Serial / GPIO: Up to 20 optional RS-232 / RS-485 / CAN bus / GPIOs

Audio: Optional analog in/out

Power: 12V – 56V, 5A

TPM: Internal TPM 2.0, optional discreet TPM 2.0

Operation system support: Win 10 IoT enterprise LTSC 2021, Win 11 Pro, Linux Mint, Ubuntu

Operating Temperature: Commercial (0°C to 45°C) up to industrial (-40°C to 70°C)

Size: standard 20cm X 20cm X 3.5 cm or larger

Mounting: VESA, DIN Rail

Contact us

Contact us here for more details, availability and prices.

Email: email@nordtechnology.dk

Phone: +45 7027 0415

– Press release from CompuLab –

CompuLab introduces UCM-iMX93 – a miniature, cost-effective System-on-Module based on NXP i.MX93 processor

Yokneam, Israel 31-May-2023 – CompuLab introduces the UCM-iMX93 System-on-Module, built around the new NXP i.MX93 System-on-Chip family.

Designed to bring out the full capabilities of the i.MX93 SoC, UCM-iMX93 provides up-to 2GB RAM and 64GB eMMC, Gbit Ethernet, RGMII, 2 USB ports, 2 CAN-FD, 7 UARTs and up-to 79 GPIOs. Display connectivity is supported with LVDS and MIPI-DSI. Measuring just 28 x 38 mm, UCM-iMX93 also features on-board WiFi 802.11ac and Bluetooth 5.3 interfaces. UCM-iMX93 is offered with full industrial temperature range of -40C to 85C.

Excellent connectivity, low cost and small size make UCM-iMX93 a versatile solution for many applications such as building and industrial control, medical devices, IoT gateways and measurement equipment.

UCM-iMX93 – NXP iMX9 System-on-Module

Software Support

UCM-iMX93 is provided with a full BSP and ready-to-run images for the Linux operating system.
The UCM-iMX93 BSP includes Linux kernel 5.15.71, Yocto Project SDK and U-Boot boot-loader.

Evaluation and Design Support

To facilitate streamlined and rapid product development, UCM-iMX93 is provided with SB-UCMIMX93 carrier board and EVAL-UCM-iMX93 evaluation kit.

SB-UCMIMX93 carrier-board is designed for easy evaluation of all UCM-iMX93 functions. It also serves as reference for the customer’s carrier-board design, providing proven building blocks for all key interfaces and peripherals. SB-UCMIMX93 schematics, bill of materials and layout are available.

EVAL-UCM-iMX93 evaluation kit includes UCM-iMX93 and SB-UCMIMX93 hardware set, 5” WXGA LCD panel, PSU, cables and engineering technical support.

Specifications

• CPU NXP i.MX9352, dual-core ARM Cortex-A55, 1.7GHz
• NPU Arm® Ethos™ U-65 microNPU
• Real-Time MCU ARM Cortex-M33
• RAM Up-to 2GB LPDDR4
• Storage Up to 64GB of soldered eMMC
• Display MIPI-DSI, 4 data lanes, up to 1920 x 1080 @60Hz
  LVDS, 4 lanes, up to 1366 x 768 p60
• Camera MIPI-CSI, 2 data lanes
• Audio Up-to 2x I2S / SAI
• Network 2x Gigabit Ethernet / RGMII
  Pre-certified 802.11ac WiFi
  Bluetooth 5.3 BLE
• USB 2x USB2.0 dual-role ports
• UART Up-to 7x UART
• CAN bus Up-to 2x CAN-FD
• General I/O Up-to 2x SDIO, 6x I2C, 7x SPI, 6x PWM, 79x GPIO
• Debug JTAG debug interface
• Supply Voltage 3.45V to 4.4V
• Connectors 2 x 100 pin, 0.4mm pitch
• Dimensions 28 x 38 x 4 mm
• Temp. range -40C to 85C

Contact us

Contact us here for more details, availability and prices.

Email: email@nordtechnology.dk

Phone: +45 7027 0415